同欣電子工業股份有限公司

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TONG HSING

Reality / Integrity / Customer First

TONG HSING

Reality / Integrity / Customer First

TONG HSING

Reality / Integrity / Customer First

TONG HSING

Reality / Integrity / Customer First

TONG HSING

Reality / Integrity / Customer First

1975

Corporation Founded
1979

Branched out into microelectronic element packaging
1994

Philippine subsidiary founded
1996

Branched out into wireless communication components
2007

Listed on the Taiwan Stock Exchange
45

years of experiences in technical product manufacturing

ABOUT

Stability, Integrity and Customers Satisfactions

TONG HSING ELECTRONIC IND., LTD. was established in 1974 in Yingge, New Taipei City, Taiwan. With its expertise in the development and production of thick film substrates and customized semiconductor micro-module packaging, TONG HSING is dedicated to research and development, process optimization and the provision of customer satisfaction.

TONG HSING's packaging services and substrate manufacturing technologies are now widely used in the applications of wireless communications, MEMS, image sensors, optoelectronic semiconductor components, LEDs, solar cells, automotive electronics, computer peripheral components, medical and networking equipment. In addition, TONG HSING ELECTRONIC IND., LTD. provides wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection and finished module testing services for image sensor, MEMS and biomedical inspection products.。

Wireless Communication
MEMS
Image Sensor
Optoelectronic Devices
LED
Solar Cells
Automotive Electronics
Computer Peripheral Components
Medical Electronics
Networking Equipment

PRODUCTS產品服務

Power Semiconductors

Provide customers with standard lead frame packaging and power semiconductor module packaging and testing services, with ceramic substrates having high thermal conductivity and high reliability, to provide customers with one-stop packaging solutions.

Direct Plated Copper

Combined with the properties of the high heat dissipation of ceramic and excellent conductivity of copper, we develop the direct plated copper(DPC) process with the innovative concept of metallized ceramic substrate.
This process utilizes sputtering and photolithography processes to form circuit patterns on the ceramic substrates. By using the sputtering process, the bonding strength between the metal and the ceramic is extremely rigid; the traces and pads are not easy to lift-off. Moreover, the circuit pattern is more precisely positioned with high density of line width/spacing compared to the conventional thick film printing process.
This technique is mainly used in the fields of high brightness, high-power LED, RF microwave communication, laser system, and semiconductor equipments, etc.

Active Metal Brazing

Combined with the properties of the high heat dissipation of ceramic and excellent conductivity of copper, the ultra-thick copper foil is brazed on the silicon nitride substrate using a specific brazing material at high temperature, and further form the circuit pattern on the silicon nitride substrate by the photolithography process. The silicon nitride technology enables the substrate to carry high thermal conductivity and high heat dissipation for high reliability applications. This technique is mainly used in the field of high-power modules for energy conversion, electric vehicles, trams, and charging systems, etc.

Thick Film Printed Circuit Substrates

The conductor circuit traces, dielectric, resistors and over glass are printed on the ceramic substrate layer by layer by utilizing the screen printing technology. After sintering the ceramic substrates at the required temperature, the resistors are trimmed to the specified resistance value by laser. This technique is mainly used in aerospace, automobile, and medical products that requires high precision and high accuracy for harsh environments.