Reliability, Integrity and Customers First
TONG HSING ELECTRONIC IND., LTD. was established in 1974 in Taiwan. With its expertise in the development and production of thick film substrates and customized semiconductor micro-module packaging, TONG HSING is dedicated to research and development, process optimization and the provision of customer satisfaction.
TONG HSING 's packaging services and substrate manufacturing technologies are now widely used in the applications of wireless communications, MEMS, image sensors, optoelectronic semiconductor components, LEDs, solar cells, automotive electronics, computer peripheral components, medical and networking equipment. In addition, TONG HSING provides wafer probing, backgrinding, wafer reconstruction, assembly, automated inspection and finished module testing services for image sensor, MEMS and biomedical inspection products.
Our corporate philosophy is to build win-win relationships with our customers and suppliers. In recent years, we have actively grown and expanded our services and competitiveness to provide quality service products and become a solid partner for our customers.