Welcome to Tong Hsing Electronic Industries, Ltd.

The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.

Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, computer peripherals, medical and network equipment.

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  Custom specilized Assembly Package.

  Application:
  RF Module, SiP, MEMS,
  CMOS Image Sensor,
  Automotive Hybrids,
  Medical, Aerospace,
  High Power Module,
  VCSEL

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  DBC Substrate

  Application:
  IGBT, MOSFET, HCPV,
  Automotive,
  Power substrates

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  DPC^(TM) & Thin Film Substrate

  Application:
  High Power LED, RF Communication,
  HCPV, Automotive, Interposer
  VCSEL, Crystal Package,
  TE Cooler, Power Substrate