Welcome to Tong Hsing Electronic Industries, Ltd.
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.
Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, computer peripherals, medical and network equipment.
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Custom specilized Assembly Package.
Application:
RF Module, SiP, MEMS,
CMOS Image Sensor,
Automotive Hybrids,
Medical, Aerospace,
High Power Module,
VCSEL -
DBC Substrate
Application:
IGBT, MOSFET, HCPV,
Automotive,
Power substrates -
DPC(TM) & Thin Film Substrate
Application:
High Power LED, RF Communication,
HCPV, Automotive, Interposer
VCSEL, Crystal Package,
TE Cooler, Power Substrate
Contact Us
Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1901 or 1903
FAX: 886-2-26791211 ext. 1901 or 1903
EMAIL: marketing@theil.com