關於同欣

Company History
- 1974
ONG HSING ELECTRONIC IND., LTD. was founded in 1974 in Yingge Township, Taipei County.
- 1976
Started production of alumina ceramic substrates.
- 1979
Started production of thick film hybrid modules.
- 1982
Started production of thick film printed capacitor networks (filters).
- 1983
Received QS-9000 certification
- 1994
Established Philippine Plant
- 1997
Started production of fine line thick film FODEL substrates using of lithography technology
- 1998
Received QS-9000 certification
- 1999
SFB approved public offering
- 2002
Awarded ISO-14001 International Environmental
- 2005
Started production of DPC (Direct Plated Copper Process) substrates for high performance memory assembly.
- 2006
Obtained OHSAS 18001 Occupational Health and Safety Management System certification
Received TS16949 Automotive Quality System Certification
Started production of DPC (Direct Plated Copper Process) substrates for high performance memory assembly.
- 2007
Stock officially listed on Taiwan Stock Exchange
- 2008
Awarded the 16th Ministry of Economic Affairs Industrial Technology Development Award - Excellent Innovation Enterprise Award
- 2010
Acquired Impac Technology Co., Ltd. and established Image Sensor Division
Received AS9100 aerospace quality system certification
- 2011
Certified by Sony Green and leading German and Japanese automakers
- 2012
Acquired DBC process technology, patents and equipment
- 2015
Established Longtan factory
- 2020
Merged Kingpak Technology Inc.as to become a wholly owned subsidiary and started construction of new headquarters in Bade
- 2021
Won the Ministry of Economic Affairs' sixth Excellent Enterprise Award
- 2022
為配合影像產品-汽車領域擴充計劃,購置奇力新(美磊)竹北廠土地及建物
公司成立永續發展委員會,首次出版永續報告書。
- 2023
八德廠生產廠房陸續完工,並開始啟用封裝及測試生產。
通過ISO 27001資訊安全系統認證