Search Results - C4 Flip Chip
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing C4 Flip Chip Service Introduction
Tong Hsing Electronic Industries, Ltd. is Microelectronic Packaging and Substrate Fabrication supplier and manufacturer with more than 44 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality C4 Flip Chip production service. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.