Home »

Search Results - C4 Flip Chip

Show list view
Show grid view
Assembly Packaging - C4 Flip Chip
Assembly Packaging - C4 Flip Chip

Assembly Packaging - C4 Flip Chip

C4 Flip Chip (controlled Collapse Chip Connection):

- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

View More »

Assembly Packaging - COB

Assembly Packaging - COB

COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

View More »

Tong Hsing C4 Flip Chip Service Introduction

Tong Hsing Electronic Industries, Ltd. is Microelectronic Packaging and Substrate Fabrication supplier and manufacturer with more than 44 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality C4 Flip Chip production service. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211

Contact Us