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Backend Technology & Others - Dicing Saw
Backend Technology & Others - Dicing Saw

Backend Technology & Others - Dicing Saw

Dicing Saw

Up to 12" available.

Backend Technology & Others - Wafer Grinding & Dicing
Backend Technology & Others - Wafer Grinding & Dicing

Backend Technology & Others - Wafer Grinding & Dicing

Wafer Grinding & Dicing:

- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.

Backend Technology & Others - Backend Operations
Backend Technology & Others - Backend Operations

Backend Technology & Others - Backend Operations

Backend Operations:

- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.


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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing Backend Technology Service Introduction

Tong Hsing Electronic Industries, Ltd. is Microelectronic Packaging and Substrate Fabrication supplier and manufacturer with more than 44 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Backend Technology production service. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.

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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211

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