Home »

Search Results - Assembly Packaging

Show list view
Show grid view
Assembly Packaging - GGI Flip Chip
Assembly Packaging - GGI Flip Chip

Assembly Packaging - GGI Flip Chip

GGI Flip Chip (Gold Gold interconnections):

- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 microns
- Major applications in power LED, SAW, TCXO and MEMS.

Assembly Packaging - C4 Flip Chip
Assembly Packaging - C4 Flip Chip

Assembly Packaging - C4 Flip Chip

C4 Flip Chip (controlled Collapse Chip Connection):

- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns

Assembly Packaging - COB
Assembly Packaging - COB

Assembly Packaging - COB

COB:

- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils.
- Ball bonds, wedge-wedge and ribbon bonds.
- Minimum bond pitch at 3.5 mils.
- Die bond accuracy down to 10 micron.
- Capable of handling six different dice.
- Wafer mapping as well as dice are available.

Assembly Packaging - SMT
Assembly Packaging - SMT

Assembly Packaging - SMT

SMT:

- Largest 0201 component user in Taiwan.
- Over 100 million chips placed every month.
- Over 99.7% yield.
- Volume experience in placing 0.5mm pitch CSP.
- Lead free & RoHS compliant.


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

View More »

Assembly Packaging - COB

Assembly Packaging - COB

COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

View More »

Tong Hsing Assembly Packaging Service Introduction

Tong Hsing Electronic Industries, Ltd. is Microelectronic Packaging and Substrate Fabrication supplier and manufacturer with more than 44 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Assembly Packaging production service. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211

Contact Us