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Tong Hsing Electronic Industries, Ltd.
Tel: 886-2-26790122 ext. 1901 or 1903
Fax: 886-2-26791211 ext. 1901 or 1903>
Address: No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
Contact Person: Mr.Ken Wu or Ms.Stellar Lin
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Tong Hsing Electronic Ind., Ltd. (ChungLi Plant) Service Introduction
Tong Hsing Electronic Industries, Ltd. is Microelectronic Packaging and Substrate Fabrication supplier and manufacturer with more than 40 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Tong Hsing Electronic Ind., Ltd. (ChungLi Plant) production service. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.