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Assembly Packaging - GGI Flip Chip

GGI-09

Assembly Packaging - GGI Flip Chip - GGI-09. Assembly Packaging - GGI Flip Chip (09)

Assembly Packaging - GGI Flip Chip (09)

Assembly Packaging - GGI Flip Chip - GGI-09. Assembly Packaging - GGI Flip Chip (09)

Assembly Packaging - GGI Flip Chip (09)

Assembly Packaging - GGI Flip Chip

GGI Flip Chip (Gold Gold interconnections):

- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 micons
- Major applications in power LED, SAW, TCXO and MEMS.

TAG: Assembly Packaging, GGI Flip Chip,

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Assembly Packaging - GGI Flip Chip | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - GGI Flip Chip substrate manufacturer since 1975.

Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.

Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.

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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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