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Assembly Packaging - GGI Flip Chip
GGI-09
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip
GGI Flip Chip (Gold Gold interconnections):
- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 micons
- Major applications in power LED, SAW, TCXO and MEMS.
TAG: Assembly Packaging, GGI Flip Chip,
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Assembly Packaging - GGI Flip Chip | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - GGI Flip Chip substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.
Contact Us
Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1901 or 1903
FAX: 886-2-26791211 ext. 1901 or 1903