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Assembly Packaging - GGI Flip Chip
GGI-09
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip (09)
Assembly Packaging - GGI Flip Chip
GGI Flip Chip (Gold Gold interconnections):
- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 microns
- Major applications in power LED, SAW, TCXO and MEMS.
TAG: Assembly Packaging, GGI Flip Chip,
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Assembly Packaging - GGI Flip Chip | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - GGI Flip Chip substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.
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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211