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Assembly Packaging - COB
COB-07
Assembly Packaging - COB (07)
Assembly Packaging - COB
COB:
- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils.
- Ball bonds, wedge-wedge and ribbon bonds.
- Minimum bond pitch at 3.5 mils.
- Die bond accuracy down to 10 micron.
- Capable of handling six different dice.
- Wafer mapping as well as dice are available.
TAG: Assembly Packaging, COB,
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Assembly Packaging - COB
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Assembly Packaging - COB | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - COB substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.
Contact Us
Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211