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Assembly Packaging - COB
COB-07
Assembly Packaging - COB (07)
Assembly Packaging - COB
COB:
- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils.
- Ball bonds, wedge-wedge and ribbon bonds.
- Minimum bond pitch at 3.5 mils.
- Die bond accuracy down to 10 micron.
- Capable of handling six different dice.
- Wafer mapping as well as dice are available.
TAG: Assembly Packaging, COB,
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Assembly Packaging - COB
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Assembly Packaging - COB | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - COB substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.
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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903