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Assembly Packaging - C4 Flip Chip

C4-08

Assembly Packaging - C4 Flip Chip - C4-08. Assembly Packaging - C4 Flip Chip (08)

Assembly Packaging - C4 Flip Chip (08)

Assembly Packaging - C4 Flip Chip - C4-08. Assembly Packaging - C4 Flip Chip (08)

Assembly Packaging - C4 Flip Chip (08)

Assembly Packaging - C4 Flip Chip

C4 Flip Chip (controlled Collapse Chip Connection):

- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns

TAG: Assembly Packaging, C4 Flip Chip,

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Assembly Packaging - C4 Flip Chip | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging - C4 Flip Chip substrate manufacturer since 1975.

Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.

Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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