TONG HSING ELECTRONIC IND., LTD.

We provide ceramic, PCB, and epoxy-molded package solutions . The packaging solution is to meet the industrial and automotive-standard reliability specifications . The package size can reach the wafer-level package (Die size + 1mm*). We enable customers to enjoy the most advanced packaging process for the niche applications. This service is serving a wide range of customers in the surveillance, industrial and automotive markets.