PRODUCTS
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![07_Packaging(圖)](data/goods/gallery/202111/1637543783051684656.jpg)
Packaging
Package
We provide ceramic, PCB, and epoxy-molded package solutions . The packaging solution is to meet the industrial and automotive-standard reliability specifications . The package size can reach the wafer-level package (Die size + 1mm*). We enable customers to enjoy the most advanced packaging process for the niche applications. This service is serving a wide range of customers in the surveillance, industrial and automotive markets.
TAG: C-MOS Imaging Products