TONG HSING ELECTRONIC IND., LTD.

Combined with the properties of the high heat dissipation of ceramic and excellent conductivity of copper, the ultra-thick copper foil is brazed on the silicon nitride substrate using a specific brazing material at high temperature, and further form the circuit pattern on the silicon nitride substrate by the photolithography process. The silicon nitride technology enables the substrate to carry high thermal conductivity and high heat dissipation for high reliability applications. This technique is mainly used in the field of high-power modules for energy conversion, electric vehicles, trams, and charging systems, etc.