Direct Bonded Copper


Combined with the properties of the high heat dissipation of ceramic and excellent conductivity of copper, we oxidize the copper foil by our proprietary technology, and use the high-temperature sintering process to directly bond the thick copper foil on the ceramic substrates. The circuit pattern is then fabricated on the DBC substrate by the photolithography process.
This DBC substrate is mainly used in the following applications:
1. Insulated Gate Bipolar Transistor (IGBT)
2. High frequency switching power supply
3. Automobile
4. Aerospace, Satellite communications
5. Solar cells
6. Telecommunication power supply
7. Laser system

TAG: Ceramic Metalized Substrate