PRODUCTS


High Frequency Wireless Communication Modules
RF Package
By integrating the surface mount, die bonding, wire bonding, flip chip, encapsulation, and back-end packaging and testing processes and technology, we are able to provide customers with various packaging types required for high-frequency wireless communication applications such as QFN、LGA、BGA、Air cavity、PCBA、SIP、AiP, etc.
TAG: Module Packaging