Direct Plated Copper


Combined with the properties of the high heat dissipation of ceramic and excellent conductivity of copper, we develop the direct plated copper(DPC) process with the innovative concept of metallized ceramic substrate.
This process utilizes sputtering and photolithography processes to form circuit patterns on the ceramic substrates. By using the sputtering process, the bonding strength between the metal and the ceramic is extremely rigid; the traces and pads are not easy to lift-off. Moreover, the circuit pattern is more precisely positioned with high density of line width/spacing compared to the conventional thick film printing process.
This technique is mainly used in the fields of high brightness, high-power LED, RF microwave communication, laser system, and semiconductor equipments, etc.

TAG: Ceramic Metalized Substrate