Stakeholder Engagement | Tong Hsing Electronic Industries, Ltd.

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Stakeholder Engagement

Based on the Company's operation , Tong Hsing identified the major categories below for stakeholders as Suppliers, Customers, employees, Investors with the main communication as below:

Suppliers
Tong Hsing establishes partnerships with our supply chain via fair, legal and honorable spirits. Most of all, our suppliers along with us should be in strict accordance with social responsibility.
Contact window: CSR@mail.theil.com.tw

Customers
If you have any inquiries for any business or quality issues, please feel free to refer to "contact us".

Employees
Tong Hsing not only holds employee forums and labor relations conferences but also provides below channels for them to provide feedback.

Stockholder and Investors
Tong Hsing hosts investor conferences on a quarterly basis.

  • Contact Window: info@mail.theil.com.tw
  • Common Share Transfer Agent and Registrar:  KGI Securities Co. LTD. Stock Administration  886-2-2389-2999


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Direct Plated Copper | DBC Substrate - Tong Hsing

Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper | Direct Plated Copper manufacturer since 1975.

Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.

Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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