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Stakeholder Engagement

Based on the Company's operation , Tong Hsing identified the major categories below for stakeholders as Suppliers, Customers, employees, Investors with the main communication as below:

Suppliers
Tong Hsing establishes partnerships with our supply chain via fair, legal and honorable spirits. Most of all, our suppliers along with us should be in strict accordance with social responsibility.
Contact window: CSR@mail.theil.com.tw

Customers
If you have any inquiries for any business or quality issues, please feel free to refer to "contact us".

Employees
Tong Hsing not only holds employee forums and labor relations conferences but also provides below channels for them to provide feedback.

Stockholder and Investors
Tong Hsing hosts investor conferences on a quarterly basis.

  • Contact Window: info@mail.theil.com.tw
  • Common Share Transfer Agent and Registrar:  KGI Securities Co. LTD. Stock Administration  886-2-2389-2999


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.

Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.

Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.

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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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