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TONG HSING ELECTRONIC INOUSTRIES, LTD. Organization Chart
Board of Directors
Tong Hsing’s board of directors consists of seven directors and three supervisors, including two independent directors. These board members possess professional backgrounds with experience in law, accounting, industry and finance.
They are accountable for the company’s operation and supervision.
To strengthen the function of compensation management for the Board of Directors, Tong Hsing established the Remuneration committee.
The Remuneration Committee is comprised two independent directors and one independent member. The Committee meets at least two times a year.
Tong Hsing’s Internal Audit function is an independent unit that reports directly to the Board of Directors and shall assist the board of directors and mangers in inspecting and reviewing defects in the internal control systems as well as measuring the operational effectiveness and efficiency. In addition, they shall make timely recommendations for improvements to ensure the sustained operating effectiveness of the systems and to provide a basis for review and correction.
When conducting self-inspections of its internal control systems, internal auditors shall first see that all internal departments and subsidiaries conduct self-inspections at least once each year, have internal audit departments review the self-inspection reports prepared by all departments and subsidiaries, and submit the self-inspection reports, together with the reports on the correction of defects and irregularities of internal control systems discovered by internal audit departments, to serve as the primary basis for the board of directors and general manager to evaluate the overall efficacy of all internal control systems and to produce Internal Control System Statements.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.