Corporate Govemence | Tong Hsing Electronic Industries, Ltd.

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Corporate Govemence

TONG HSING ELECTRONIC INOUSTRIES, LTD. Organization Chart

Organization Chart

Board of Directors
Tong Hsing’s board of directors consists of seven directors and three supervisors, including two independent directors. These board members possess professional backgrounds with experience in law, accounting, industry and finance.
They are accountable for the company’s operation and supervision.

Remuneration Committee
To strengthen the function of compensation management for the Board of Directors, Tong Hsing established the Remuneration committee.
The Remuneration Committee is comprised two independent directors and one independent member. The Committee meets at least two times a year.

Internal Audit
Tong Hsing’s Internal Audit function is an independent unit that reports directly to the Board of Directors and shall assist the board of directors and mangers in inspecting and reviewing defects in the internal control systems as well as measuring the operational effectiveness and efficiency. In addition, they shall make timely recommendations for improvements to ensure the sustained operating effectiveness of the systems and to provide a basis for review and correction.
When conducting self-inspections of its internal control systems, internal auditors shall first see that all internal departments and subsidiaries conduct self-inspections at least once each year, have internal audit departments review the self-inspection reports prepared by all departments and subsidiaries, and submit the self-inspection reports, together with the reports on the correction of defects and irregularities of internal control systems discovered by internal audit departments, to serve as the primary basis for the board of directors and general manager to evaluate the overall efficacy of all internal control systems and to produce Internal Control System Statements.


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing Corporate Govemence Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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