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Tong Hsing Electronic Industries, Ltd.

COMPANY - . Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries, Ltd.

Tong Hsing Electronic Industries Limited is a world leader in micro module foundry services. We specialize in the development and manufacture of micro modules and custom semiconductor packages. Since 1975, Tong Hsing has held to the principle of providing best solutions for the company and its customers, devoting our energies to become our customers' best business partner by offering substantial benefits in the form of competitive pricing, timely delivery and quality products.

Our strategic plan is to provide state-of-the-art microelectronic packaging technology to various industries manufacturing wireless communications, sensors, fiber optics, LED, automotive electronics, computer peripherals, medical and network equipment.

Tong Hsing is committed to its business philosophy of constantly building long term WIN/WIN relationships. We will continue to accomplish this by investing in R&D, adding manufacturing facilities, improving quality, reducing cycle time and lowering costs to provide our customers with the best service possible.



USA Contact: Sara Rhoads

Tong Hsing USA office: 1842 W. Grand Road #102, Tucson, AZ 85745, U.S.A.

E-mail: sara@thusa.com

Tel: +1-520-791-7825


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing COMPANY Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.

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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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