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Tong Hsing Electronic Industries, Ltd.
Tong Hsing Electronic Industries Limited is a world leader in micro module foundry services. We specialize in the development and manufacture of micro modules and custom semiconductor packages. Since 1975, Tong Hsing has held to the principle of providing best solutions for the company and its customers, devoting our energies to become our customers' best business partner by offering substantial benefits in the form of competitive pricing, timely delivery and quality products.
Our strategic plan is to provide state-of-the-art microelectronic packaging technology to various industries manufacturing wireless communications, sensors, fiber optics, LED, automotive electronics, computer peripherals, medical and network equipment.
Tong Hsing is committed to its business philosophy of constantly building long term WIN/WIN relationships. We will continue to accomplish this by investing in R&D, adding manufacturing facilities, improving quality, reducing cycle time and lowering costs to provide our customers with the best service possible.
USA Contact: Sara Rhoads
Tong Hsing USA office: 1842 W. Grand Road #102, Tucson, AZ 85745, U.S.A.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.