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Technology - . Tong Hsing Technology Leadership

Tong Hsing Technology Leadership

In 1975, Tong Hsing Electronics established an operation in Taipei country, Taiwan. We specialized in development and manufacture of custom semiconductor micro module assembly, and thick film and thin film substrates.

Our strategic plan is to provide high quality microelectronic packaging and substrate technology to various industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

A. Ceramic Thick Film/Thin Film Substrate Fabrication.
B. Microelectronic packaging - SMT, COB, C4 flip chip, GGI flip chip, and Backend.

The latest design guidelines of Tong Hsing are in the following:

1. SMD
2. COB
3. Backend
4. CSP
5. Thick Film Metallized Substrate
6. DPC
7. Multi-layer DPC
8. Control Plan for Electro Plating Cu / Ni / Au
For detail information, please don't hesitate to contact us directly.


Major Production Equipment:

Laser MachiningChipmounter
PrinterCleaner
FurnaceWafer Mounter
YAG Laser TrimmerReflow
Sputter SystemDie Bonder
Mas k Aligner/Expos ureWire Bonder
DeveloperFlip Chip Bonder(GGI/C4)
Plating Lines--CuPlasma Cleaner
Plating Lines--Ni/AuTransfer Molder
Plating Ni/Pd/AuDispenser
E'less- CuDicing Saw
E'less- AgTaping
E'less--Cu/Ni/AuDetaping
Strip & EtchOven
Surface MeasurementSorter
AOIAVI
Flying Probe SystemFT Handler
Grinding/LappingProber
Laser Marking MachineTester

In clean room, ranging from class 10 to class 1,000, Tong Hsing's substrate manufacturing capability includes precisioning equipment such as CO2 Laser machines, screen printers, firing furnaces, laser trimmers and thin film sputtering systems with copper, nickel, silver, palladium and gold plating lines all set up in clean room environment. These modern facilities allow us to provide product in large quantities and meet the most strict quality requirements.

Technology - . Technology floor

Technology floor

Technology - . Laser Machine

Laser Machine

Technology - . Screen printer

Screen printer

Technology - . Firing Furnace

Firing Furnace

Technology - . Firing Furnace

Firing Furnace

Technology - . Laser Trimming

Laser Trimming

Technology - . Sputtering

Sputtering

Technology - . Plating

Plating

Technology - . Plating

Plating


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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Direct Plated Copper | DBC Substrate - Tong Hsing

Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper | Direct Plated Copper manufacturer since 1975.

Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.

Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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