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In 1975, Tong Hsing Electronics established an operation in Taipei country, Taiwan. We specialized in development and manufacture of custom semiconductor micro module assembly, and thick film and thin film substrates.
Our strategic plan is to provide high quality microelectronic packaging and substrate technology to various industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, computer peripherals, medical and network equipment.
A. Ceramic Thick Film/Thin Film Substrate Fabrication.
B. Microelectronic packaging - SMT, COB, C4 flip chip, GGI flip chip, and Backend.
The latest design guidelines of Tong Hsing are in the following:
5. Thick Film Metallized Substrate
7. Multi-layer DPC
8. Control Plan for Electro Plating Cu / Ni / Au
For detail information, please don't hesitate to contact us directly.
Major Production Equipment:
|YAG Laser Trimmer||Reflow|
|Sputter System||Die Bonder|
|Mas k Aligner/Expos ure||Wire Bonder|
|Developer||Flip Chip Bonder(GGI/C4)|
|Plating Lines--Cu||Plasma Cleaner|
|Plating Lines--Ni/Au||Transfer Molder|
|E'less- Cu||Dicing Saw|
|Strip & Etch||Oven|
|Flying Probe System||FT Handler|
|Laser Marking Machine||Tester|
In clean room, ranging from class 10 to class 1,000, Tong Hsing's substrate manufacturing capability includes precisioning equipment such as CO2 Laser machines, screen printers, firing furnaces, laser trimmers and thin film sputtering systems with copper, nickel, silver, palladium and gold plating lines all set up in clean room environment. These modern facilities allow us to provide product in large quantities and meet the most strict quality requirements.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.