Home » OEM
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film/Thin Film Substrate Fabrication:
* SiP Packaging for WLAN, GPS & Bluetoogh
* MEMS Packaging
* CMOS Image Sensor Packaging
* Reconstruction Wafer
* Chip Probing and Final Test
* PCB assembly with SMT and/or COB Processes
* Automotive Hybrids
* Thin Film on Alumina and AlN
* Thick Film on Alumina
* DBC on Alumina and AlN
Years of Experience : Over 30 Years
Main Customers :
- Advanced Bionics
- Aptina Imaging
- Omnivision Technologies
With many years of experience in thick film printing and flying together with newly developed thin film DPC , Tong Hsing offers very high performance and economy substrate technology idea for many applications including RF microwave, high brightness LED, MEMS, solar cell, fuel cell and power modules.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.