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OEM Capacity

OEM - . Tong Hsing - OEM Capacity

Tong Hsing - OEM Capacity

Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film/Thin Film Substrate Fabrication:

* RF Modules for Cellular Handsets, WLAN, and WiMax
* SiP Packaging for WLAN, GPS & Bluetoogh
* MEMS Packaging
* CMOS Image Sensor Packaging
* Reconstruction Wafer
* Chip Probing and Final Test
* PCB assembly with SMT and/or COB Processes
* Automotive Hybrids
* Thin Film on Alumina and AlN
* Thick Film on Alumina
* DBC on Alumina and AlN

Years of Experience : Over 30 Years

Main Customers :

- Advanced Bionics
- Anadigics
- Aptina Imaging
- Delphi
- Omnivision Technologies
- Sensata
- Skyworks
- TI

Excellent Productivity

With many years of experience in thick film printing and flying together with newly developed thin film DPC , Tong Hsing offers very high performance and economy substrate technology idea for many applications including RF microwave, high brightness LED, MEMS, solar cell, fuel cell and power modules.





OEM - . Flying Probe

Flying Probe

OEM - . RF Microwave

RF Microwave

OEM - . High Brightness LED

High Brightness LED



OEM - . Solar Cell

Solar Cell

OEM - . Fuel Cell

Fuel Cell

OEM - . Power Modules

Power Modules


Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing OEM Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us