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OEM - . Tong Hsing - OEM Capacity

Tong Hsing - OEM Capacity

Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film/Thin Film Substrate Fabrication:

* RF Modules for Cellular Handsets, WLAN, and WiMax
* SiP Packaging for WLAN, GPS & Bluetoogh
* MEMS Packaging
* CMOS Image Sensor Packaging
* Reconstruction Wafer
* Chip Probing and Final Test
* PCB assembly with SMT and/or COB Processes
* Automotive Hybrids
* Thin Film on Alumina and AlN
* Thick Film on Alumina
* DBC on Alumina and AlN


Years of Experience : Over 30 Years

Main Customers :



- AEI
- Advanced Bionics
- Anadigics
- Aptina Imaging
- DDC
- Delphi
- Omnivision Technologies
- Sensata
- Skyworks
- TI



Excellent Productivity

With many years of experience in thick film printing and flying together with newly developed thin film DPC , Tong Hsing offers very high performance and economy substrate technology idea for many applications including RF microwave, high brightness LED, MEMS, solar cell, fuel cell and power modules.

OEM - . DPC

DPC

OEM - . AOI

AOI

OEM - . Flying Probe

Flying Probe

OEM - . RF Microwave

RF Microwave

OEM - . High Brightness LED

High Brightness LED

OEM - . MEMS

MEMS

OEM - . Solar Cell

Solar Cell

OEM - . Fuel Cell

Fuel Cell

OEM - . Power Modules

Power Modules


Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.

Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.

Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us