Management | Tong Hsing Electronic Industries, Ltd.

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Management

Management

Vision:

- Customer Satisfaction
- Quality
- Turnaround / Delivery Time
- Productivity


Mission:

- Become the leading back-end service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific
- Continue the expansion of the production scale of Thin Film DPC substrates used in High Brightness LED
- Ramp up the production of ultra high brightness LED used in projectors
- Promote DBC technology for the power module used in Renewable Energy, HEV and EV
- Expand the business in Fuel Cell with MEMS technology for portable devices
- Ramp up the production of medical electronic devices, such as next generation DNA sequencing chips
- Continue the expansion of the production scale of Image Sensor , including Circuit Probing, Reconstruction Wafer, Assembling and Final Test


Environmental & Occupational Health and Safety Policy:

Tong Hsing is the professional manufacturer in microelectronic module packaging. In order to provide responsibility to the employees and society, Tong Hsing complies with every requirement set forth in ISO 14001 Environmental Management System and OHSAS 18001 Occupational Health & Safety Assessment Series, and is committed to the following: Comply with the government laws and orders. Increase environmental consciousness. Value the importance of health and safety. Practice risk management. Strengthen educational training. Implement continuous improvement. Implement precautions against pollution. Reduce occupational hazards. Tong Hsing will continue on with providing educational and guidance to our personnel and company representative engaged to work, so as to understand and preserve this policy, and also disclose this to the public.

Our History:


1974Tong Hsing Established
1976Started Production of Alumina Ceramic Substrates
1977Started Production of Thick Film Print and Fire
1979Started Production of Hybrid Modules
1986Shipped 500K Modules of Electronic Fuse
1989Received IECQ Manufacturer Approval
1993Started Large Scale Production of Thick Film Copper Process
1993Received ISO-9002 Certification
1994Established Tong Hsing Electronics (Philippines) Inc.
1995Started Production of Photo-Sensitive Thick Film Circuits
1996Established CIM System to Track the WIP through LAN
1997Started Mass Production of CDMA Power Amplifier Modules
1998Received QS-9000/ISO-9001 Certification
1999Started Mass Production of GSM Power Amplifier Modules
2001Started Production of Thin Film DPC Substrate Fabrication
2002Received ISO14000 Certification
2006Received TS16949 and OHSAS 18001 Certification
2007IPO at Taiwan Stock Exchange on Nov.15th
2008Won the “Excellent Enterprise Innovation Award” from MOEA (Ministry of Economic Affairs)
2009Received AS9100 Certification.
2010Acquired Impac to form a new Image Sensor Group Achieved “0” ppm for All Products Shipped to Automotive Customers for two consecutive years.
2011Sony Green Partners ~ Certification Received; Full manufacturing approval was granted by both a well-known German and Japanese Auto Parts Manufacturer for Luxury Cars
2012Acquired DBC Production Assets, Process, Know-how, and IP from HCS
2014Acquired Longtan work site

Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing Management Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us