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- Customers First
- Happiness Enterprise
- Become the leading back-end service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific
- Continue the expansion of the production scale of Thin Film DPC substrates used in High Brightness LED
- Ramp up the production of ultra high brightness LED used in projectors
- Promote DBC technology for the power module used in Renewable Energy, HEV and EV
- Expand the business in Fuel Cell with MEMS technology for portable devices
- Ramp up the production of medical electronic devices, such as next generation DNA sequencing chips
- Continue the expansion of the production scale of Image Sensor , including Circuit Probing, Reconstruction Wafer, Assembling and Final Test
Corporate Social Responsibility and Environmental Protection Policy:
Tong Hsing is the professional manufacturer in microelectronic module packaging. In order to provide responsibility to the employees and society, Tong Hsing complies with every requirement set forth in ISO 14001 Environmental Management System and Occupational Safety and Health Management System ISO 45001, and is committed to the following:
Environmental Protection Policy：
Corporate Social Responsibility and Environmental Protection Policy
Abide by laws and regulations and fulfill social responsibilities.
Continue to operate with integrity and comply with corporate governance.
Pay attention to the rights of employees and create a friendly workplace.
Maintain health and safety and eliminate potential hazards.
Strengthen environmental protection awareness and implement pollution prevention.
Implement risk management and promote continuous improvement.
|1974||Tong Hsing Established|
|1976||Started Production of Alumina Ceramic Substrates|
|1977||Started Production of Thick Film Print and Fire||1979||Started Production of Hybrid Modules|
|1986||Shipped 500K Modules of Electronic Fuse||1989||Received IECQ Manufacturer Approval|
|1993||Started Large Scale Production of Thick Film Copper Process||1993||Received ISO-9002 Certification|
|1994||Established Tong Hsing Electronics (Philippines) Inc.||1995||Started Production of Photo-Sensitive Thick Film Circuits|
|1996||Established CIM System to Track the WIP through LAN||1997||Started Mass Production of CDMA Power Amplifier Modules|
|1998||Received QS-9000/ISO-9001 Certification||1999||Started Mass Production of GSM Power Amplifier Modules|
|2001||Started Production of Thin Film DPC Substrate Fabrication||2002||Received ISO14000 Certification|
|2006||Received TS16949 and OHSAS 18001 Certification||2007||IPO at Taiwan Stock Exchange on Nov.15th|
|2008||Won the “Excellent Enterprise Innovation Award” from MOEA (Ministry of Economic Affairs)|
|2009||Received AS9100 Certification.|
|2010||Acquired Impac to form a new Image Sensor Group Achieved “0” ppm for All Products Shipped to Automotive Customers for two consecutive years.|
|2011||Sony Green Partners ~ Certification Received; Full manufacturing approval was granted by both a well-known German and Japanese Auto Parts Manufacturer for Luxury Cars|
|2012||Acquired DBC Production Assets, Process, Know-how, and IP from HCS|
|2014||Acquired Longtan work site|
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Direct Bonded Copper | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.