Tong Hsing Electronics Appoints Chia-Shy Chang as Vice President on Jul. 4th, 2013
Tong Hsing is pleased to announce the promotion of Chia-Shy Chang to Vice President of Marketing & Innovations.
Chia-Shy Chang, who previously served as Director of New Customer Development Department since 2010, has been appointed as Vice President of Marketing & Innovations, effective July 5th, 2013. Since joining the executive team as Director of New Customer Development in 2009, Chia-Shy has proven to be a visionary leader who has helped propel our growth in Image Sensor Packaging. In this new role, Chia-Shy will have the overall responsibility for the Marketing Division and will collaborate closely with the marketing team including Sales, Customer Service & Production Control, and New Customer Development.
With his strong marketing and engineering background, Chia-Shy is sure to bring his own unique experiences and background to his leadership of Tong Hsing’s Marketing Division.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Tong Hsing Electronics Appoints Chia-Shy Chang as Vice President on Jul. 4th, 2013 Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.