Tong Hsing Electronic Industries, Ltd. acquired Longtan work site
- Land: ~14,000 sqm
- Overall building space: ~28,000 sqm (2.5X of THECL)
- 3 Production Floors: ~15,600 sqm
- Affiliated with HsinChu Science Industry Park (Bond House)
- Product / Process service:
- Image Sensor Chip Probe
- Image Sensor Re-con Wafer
- Image Sensor Package Assembly
- Image Sensor Final Test
- RW: 100,000 pcs/month 8" wafer size equivalent (include 36,000 pcs/month 12" laser capacity) , 25% increased
- Package Assembly: 3kk units per month, 150% increased.
Site Map of TH Taiwan Factories
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Tong Hsing Electronic Industries, Ltd. acquired Longtan work site Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.