Tong Hsing Brings Down Costs with Copper-plated Ceramic
SEMI Global Update, Paula Doe/SEMI Emerging Markets, January 5, 2010 --
Meanwhile Tong Hsing argues that its copper-plated ceramic material may significantly bring down the cost of high-performance LED package substrates . SVP of marketing and technology Heinz Ru argues that the Taiwan company’s copper-plated ceramic LED substrate can bring package substrate costs down to 5-10% of the $0.60 total cost of a high-power 1W, 100 lm cold white LED chip. It uses a proprietary bonding layer to get a stronger bond, and fills the vias during the surface plating step, instead of requiring a separate process, for a lower cost production process, while the high-thermal conductivity of the copper gives better thermal performance. Production is done at high-throughput on an automated rack plating line, but is reportedly also easily customizable to different materials and thickness for metallization and ceramic for different designs. Thermal conductivity of copper is around 390 Watts/Kelvin meter (W/mK), the AlN substrate170W/mK (or Al2O3 ~30W/mK), compared to silicon at about 150W/mK.
Tong Hsing has been developing smaller ceramic packages for major LED makers since 2003, and it expects that its LED substrate business will jump to about 50% of company revenues in 2010, up from about 33% from all thick and thin film ceramic substrates last year. It’s now also working on applying the same technology to packaging triple-junction PV cells and control modules for hybrid vehicles.
The company originally saw fast growth from supplying ceramic packages for power amp modules for cell phones, but sales plummeted when that market all switched over to overmold packaging, so the company turned to a diverse range of specialty packaging for MEMS, and medical markets that it could make on its existing equipment. “We go after startup companies that need help,” says Ru. “We’re betting that maybe 10% of these startup opportunities will take off, but if they don’t, at least they have good technology and pay for development, and the entrepreneurs who started them will come back to us the next time they start a company.”
Source: SEMI Global Update article “$3 Billion Opportunity for Back-end Equipment and Materials Suppliers: HB-LED Packaging” http://www.semi.org/cms/groups/public/documents/web_content/ctr_033640.htm
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Tong Hsing Brings Down Costs with Copper-plated Ceramic Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.