Building D at the Taipei factory was completed at the end of June this year
Tong Hsing Building D at the Taipei factory was completed at the end of June this year
Clean Room For Assembly
Clean Room for Sputtering
For Laser Machining
Building D at the Taipei factory was completed at the end of June this year. The total floor space is around 100,000 Meter square. This will double our floor space and our clean room space by 100%. We have been moving in part of our assembling equipment since May 16, 2011.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Building D at the Taipei factory was completed at the end of June this year Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.