新聞中心
Bade Plant - Newly built plant construction beam erection ceremony
TONG HSING ELECTRONIC IND., LTD. (6271) held a ceremony in Bade District, Taoyuan City on August 23rd to mark the opening of the new Bade Plant, adding to the new production capacity of TONG HSING ELECTRONIC IND. TONG HSING ELECTRONIC IND., LTD. said that the company's revenue to date has continued to reach record highs. With an eye on new applications in the future, including automotive image sensors, low-orbit satellite wireless communication modules, bio-MEMS medical sensor assembly, plant lighting, automotive lighting-related ceramic substrates, and even third-generation semiconductors, the company is moving ahead and expanding its production capacity to fully meet the needs of its customers. The company is committed to providing high standard dedicated independent production lines, and will continue to invest in Taiwan, creating an estimated 2,300 new jobs for the local government. The new Bade factory and corporate headquarters, designed by renowned architect Mr. Yao Renxi, is located in the Bade District of Taoyuan City, near the Danan Interchange, offering great convenience in terms of geography and communication with the existing Yingge factory, and enhancing the company's capacity, technology and human resources in terms of mechanization and support. The new site will cover an area of approximately 16,700 square meters with a total floor area of 89,000 square meters, including the headquarters building, factory and staff dormitories, creating an environmentally friendly and user-friendly working space that will showcase the vitality of the company. The new factory will be built with an eye on the next 5-10 years to meet the strong packaging and testing needs of our customers in Image Products, ceramic substrates, Hybrid ICs, and high frequency wireless communication modules. We aim to become an important assembly and testing partner for world-class companies and expect TONG HSING ELECTRONIC IND. to become a major leader in this field.