Substrate Manufacturing Services - Thick Film Substrate - Taiwan high quality Substrate Manufacturing Services - Thick Film Substrate manufacturer | Tong Hsing Electronic Industries, Ltd.

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Substrate Manufacturing Services - Thick Film Substrate

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Substrate Manufacturing Services - Thick Film Substrate

Substrate Manufacturing Services - Thick Film Substrate
Thick_Film_01

Thick Film Substrate
Applications: Automotive, Sensors



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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing Substrate Manufacturing Services - Thick Film Substrate Service Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan Substrate Manufacturing Services - Thick Film Substrate supplier and manufacturer with more than 40 years experence. Since 1975, in the Global Microelectronic Packaging and Ceramic Substrate Fabrication Market, Tong Hsing has been offering our customers high quality Substrate Manufacturing Services - Thick Film Substrate production service. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.

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Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

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