Substrate Manufacturing Services - Thick Film Substrate
Thick Film Substrate
Applications: Automotive, Sensors
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Substrate Manufacturing Services - Thick Film Substrate - Tong Hsing
Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Substrate Manufacturing Services - Thick Film Substrate manufacturer since 1975.
Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.
Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, computer peripherals, medical and network equipment.
Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.