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Backend Technology & Others

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Backend Technology & Others - Dicing Saw

Backend Technology & Others - Dicing Saw
DicingSaw-12

Dicing Saw

Up to 12" available.

Backend Technology & Others - Wafer Grinding & Dicing

Backend Technology & Others - Wafer Grinding & Dicing
Wafer-11

Wafer Grinding & Dicing:

- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.

Backend Technology & Others - Backend Operations

Backend Technology & Others - Backend Operations
Backend-10

Backend Operations:

- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.



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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Backend Technology & Others | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing

Tong Hsing Electronic Industries, Ltd. is a Backend Technology & Others substrate manufacturer since 1975.

Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.

Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 40 years of experience, Tong Hsing ensures each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us