Backend Technology & Others - Tong Hsing

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Backend Technology & Others

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Backend Technology & Others - Dicing Saw

Backend Technology & Others - Dicing Saw
DicingSaw-12

Dicing Saw

Up to 12" available.

Backend Technology & Others - Wafer Grinding & Dicing

Backend Technology & Others - Wafer Grinding & Dicing
Wafer-11

Wafer Grinding & Dicing:

- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.

Backend Technology & Others - Backend Operations

Backend Technology & Others - Backend Operations
Backend-10

Backend Operations:

- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.



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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Backend Technology & Others - Tong Hsing

Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Backend Technology & Others manufacturer since 1975.

Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.

Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us