Wafer Grinding & Dicing:
- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.
- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Backend Technology & Others - Tong Hsing
Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Backend Technology & Others manufacturer since 1975.
Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.
Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, computer peripherals, medical and network equipment.
Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.