Wafer Grinding & Dicing:
- Grinding: 6", 8", 12" wafers available.
- Minimum thickness of 10 mils for 12" wafers, 6 mils for 8", 6 mils for 6" wafers.
- Overmold, liquid encapsulation, glob top, metal can, plastic lid, hermetic ceramic lid or metal lids, Temex CSP are all available.
- Auto packing into JEDEC trays, tubes and tape & reel are all available.
- Yag laser, green laser and pad printing for marking.
- Both LGA and BGA are available.
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Backend Technology & Others | Ceramic Thin Film & Thick Film Substrate Manufacturing - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Backend Technology & Others substrate manufacturer since 1975.
Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film Metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au.
Tong Hsing has been offering customers high-quality direct bonded copper substrate manufacturing services, both with the sophisticated thin/thick film technology and 44 years of experience, Tong Hsing ensures each client's demands are met.