Assembly Packaging Services - Tong Hsing

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Assembly Packaging - GGI Flip Chip

Assembly Packaging - GGI Flip Chip
GGI-09

GGI Flip Chip (Gold Gold interconnections):

- Maximum die size: 5mm x 5mm
- Maximum number of bumps: 20
- Minimum bump pitch: 150 micons
- Major applications in power LED, SAW, TCXO and MEMS.

Assembly Packaging - C4 Flip Chip

Assembly Packaging - C4 Flip Chip
C4-08

C4 Flip Chip (controlled Collapse Chip Connection):

- Eutectic, lead free and high lead solder bumps are available.
- Underfill available.
- Minimun pitch: 200 microns

Assembly Packaging - COB

Assembly Packaging - COB
COB-07

COB:

- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils.
- Ball bonds, wedge-wedge and ribbon bonds.
- Minimum bond pitch at 3.5 mils.
- Die bond accuracy down to 10 micron.
- Capable of handling six different dice.
- Wafer mapping as well as dice are available.

Assembly Packaging - SMT

Assembly Packaging - SMT
SMT-06

SMT:

- Largest 0201 component user in Taiwan.
- Over 100 million chips placed every month.
- Over 99.7% yield.
- Volume experience in placing 0.5mm pitch CSP.
- Lead free & RoHS compliant.



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Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Assembly Packaging Services - Tong Hsing

Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Assembly Packaging Services manufacturer since 1975.

Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.

Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us