Available Substrate Technologies - Tong Hsing

Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

View More »

Assembly Packaging - COB

Assembly Packaging - COB

COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

View More »

Available Substrate Technologies - Tong Hsing

Based in Taiwan, Tong Hsing Electronic Industries, Ltd. is a Available Substrate Technologies manufacturer since 1975.

Smaller, thinner, better thermal management and smaller footprint in thin film and thick film design, Tong Hsing's mems technology is patented, design guidelines are followed and ISO, TS 16949, RoHS certified.

Tong Hsing's direct plated copper and DBC substrate are applied in industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.

Tong Hsing has been offering customers high quality ceramic thin film and thick film. Both with advanced mems technology and 40 years of experience, Tong Hsing makes sure each client's demands are met.

Contact Us

Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext. 1022 or 1903
FAX: 886-2-26791211 ext. 1022 or 1903

Contact Us