Tong Hsing’s organization has four main components, Taipei Headquarters, the Taipei Manufacturing Site, Chung Li Manufacturing Site and Philippines Manufacturing Site. In addition, our Arizona office in the U.S. facilitates communication by providing factory support and business development activities.
Tong Hsing also has a network of experienced, knowledgeable representatives in key markets around the world. Production facilities in Taipei, Chun-Li and the Philippines utilize identity materials, processes, equipment and control procedures after being developed and qualified in Taiwan. This dual source provides us with special capabilities for both large scale and smaller markets to satisfy each customer’s needs.
Address: 6th Floor, 83, Yenping South Road, Taipei, Taiwan
Address: Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: + 886-2-26790122 (ext. 1022 or 1903)
FAX: +886-2-26791211 (ext. 1022 or 1903)
Email: email@example.com; firstname.lastname@example.org
Plant I address:
116 Excellence Avenue, corner Competence Drive, Carmelray Industrial Business Park I, Canlubang, Calamba, Laguna, 4028 Philippines
Plant II address:
103 Prosperity Avenue, Carmelray International Business Park I, Canlubang, Calamba, Laguna, 4028 Philippines
To visit our Philippine facility, please go to http://www.tonghsing.ph/
USA Contact: Mr. Bob Carter
Address: Paoli Executive Green II, 43 Leopard Road, Suite 200, Paoli, PA 19301
Address: 8F, No.27, Ji-Lin Rd., Chung-Li Industrial Park, Tao-Yuan Hsien, Taiwan
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 40 years experience, Tong Hsing always make sure to meet each customer's demand.