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IECQ QC080000
Environment System
IECQ QC080000
Registrar Afnor
Valid period : 2016/10/19 ~ 2020/01/21
Certified Since : 2014/1/22
Certification No. IECQ-H AFNOR 14.0004
Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB:- Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing IECQ QC080000 Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN since 1975. With both advanced technology and 44 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
No. 55, Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122
FAX: 886-2-26791211