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Tong Hsing Technology Leadership
In 1975, Tong Hsing Electronics established an operation in Taipei country, Taiwan. We specialized in development and manufacture of custom semiconductor micro module assembly, and thick film and thin film substrates.
Our strategic plan is to provide high quality microelectronic packaging and substrate technology to various industries including wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, military, computer peripherals, medical and network equipment.
A. Ceramic Thick Film/Thin Film Substrate Fabrication.
B. Microelectronic packaging - SMT, COB, C4 flip chip, GGI flip chip, and Backend.
The latest design guidelines of Tong Hsing are in the following:
1. SMD
2. COB
3. Backend
4. CSP
5. Thick Film Metallized Substrate
6. DPC
7. Multi-layer DPC
8. Control Plan for Electro Plating Cu / Ni / Au
For detail information, please don't hesitate to contact us directly.
Major Production Equipment:
| Laser Machining | Chipmounter |
| Printer | Cleaner |
| Furnace | Wafer Mounter |
| YAG Laser Trimmer | Reflow |
| Sputter System | Die Bonder |
| Mas k Aligner/Expos ure | Wire Bonder |
| Developer | Flip Chip Bonder(GGI/C4) |
| Plating Lines--Cu | Plasma Cleaner |
| Plating Lines--Ni/Au | Transfer Molder |
| Plating Ni/Pd/Au | Dispenser |
| E'less- Cu | Dicing Saw |
| E'less- Ag | Taping |
| E'less--Cu/Ni/Au | Detaping |
| Strip & Etch | Oven |
| Surface Measurement | Sorter |
| AOI | AVI |
| Flying Probe System | FT Handler |
| Grinding/Lapping | Prober |
| Laser Marking Machine | Tester |
In clean room, ranging from class 10 to class 1,000, Tong Hsing's substrate manufacturing capability includes precisioning equipment such as CO2 Laser machines, screen printers, firing furnaces, laser trimmers and thin film sputtering systems with copper, nickel, silver, palladium and gold plating lines all set up in clean room environment. These modern facilities allow us to provide product in large quantities and meet the most strict quality requirements.
Technology floor
Laser Machine
Screen printer
Firing Furnace
Firing Furnace
Laser Trimming
Sputtering
Plating
Plating
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Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903