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News Title Date
Tong Hsing – Presented with “Awards for International Trade in 2010”

The 19th Taiwan Excellence Awards (2011) is directed by the Ministry of Economic Affairs, sponsored by the Bureau of Foreign Trade and executed by the Taiwan External Trade Development Council. On Aug. 31 this year, the “Awards for International Trade in 2010” was received by Mr. Henry Liu – President of Tong Hsing from the hands of Mr. Wu Den-yih – Premier of Taiwan, during a ceremony at the Taipei International Convention Center for outstanding export growth in 2010. The industries with various sales in Taiwan have been expected to have continuous worldwide growth under “Innovative Prospective & Embrace Global” spirit to improve the industry competence.

2011/08/31
Building D at the Taipei factory was completed at the end of June this year

Building D at the Taipei factory was completed at the end of June this year. The total floor space is around 100,000 Meter square. This will double our floor space and our clean room space by 100%. We have been moving in part of our assembling equipment since May 16, 2011.

2011/09/07
Tong Hsing Brings Down Costs with Copper-plated Ceramic

SEMI Global Update, Paula Doe/SEMI Emerging Markets, January 5, 2010 --

2010/01/05
ANADIGICS Names Tong Hsing Supplier of the Year

Warren, New Jersey, December 14, 2009 --

2009/12/14
Over 32,000 LEDs will power 2009 Times Square New Year's Eve Ball

LEDs MAGAZINE, November 17, 2008

2008/11/17
Tong Hsing has been awarded the Excellent Enterprise Innovation Award

Tong Hsing has been awarded the Excellent Enterprise Innovation Award

2008/10/13

Promotion

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Substrate Manufacturing Services - Thin Film Substrate(DPC)

Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles

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Assembly Packaging - COB

Assembly Packaging - COB

COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.

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Tong Hsing Production Service and Introduction

Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.

Contact Us

Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903

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