Home » News » ANADIGICS Names Tong Hsing Supplier of the Year
ANADIGICS Names Tong Hsing Supplier of the Year
2009/12/14
Tong Hsing
Warren, New Jersey, December 14, 2009 --
ANADIGICS, Inc. (Nasdaq: ANAD) today announced it has awarded Tong Hsing Electronic Industries Limited the Supplier of the Year award. The Supplier of the Year Award program is being launched in 2009 to recognize suppliers who go above and beyond to deliver on its commitments and ensure ANADIGICS’ success. The announcement was made during the inauguration ceremony of Tong Hsing's newest facility in the Philippines. The 2009 Award is the first year launch by ANADIGICS of this prestigious award.
Tong Hsing won the Supplier of the Year award based on its exemplary performance in several key areas including technology, quality, responsiveness, delivery and total cost management. The award was also made in recognition of the strong strategic relationship with the Company.
“This is an incredible honor given to Tong Hsing by ANADIGICS. It is with great pride that I accept this award on behalf of the entire team that has made it possible,” said Mr. Jay Yang, chief executive officer, Tong Hsing Electronic Industries Limited. “The team from both Tong Hsing and ANADIGICS have worked side by side for over ten years to bring us to where we are today. We look forward to this partnership growing for many years to come.”
“We’re pleased to be able to recognize Tong Hsing for its outstanding performance and dedication to quality and success throughout 2009,” stated Russ Wagner, vice president, operations for ANADIGICS. “The importance of outstanding quality and operational excellence throughout the entire manufacturing value chain is key to our company’s success. In Tong Hsing, we have a supplier that understands our strategy and business needs and delivers without fail on a regular basis.”
http://www.anadigics.com/news/press_releases/anadigics_names_tong_hsing_supplier_of_the_year
Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903
