Excellent Enterprise Innovation Award
Tong Hsing has been awarded the "Excellent Enterprise Innovation Award" by the ministry of Economic Affairs in 2008 during the 16th Annual Industrial Technology Advancement Awards!
Issuer : The ministry of Economic Affairs
Issue Date : Oct., 2008
Special Appreciation Award
Issuer : Advanced Energy
Issue Date : Sep., 2008
2008 TI Regional Supplier Recognition Award winner
Issuer : Texas Instruments
Issue Date : Apr., 2009
The Supplier of the Year Award
Issuer : Anadigics
Issue Date : Dec., 2009
Promotion
Substrate Manufacturing Services - Thin Film Substrate(DPC)
Thin Film DPC Substrate 1. High Power LED 2. Microwave (Wireless Communication) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles
Assembly Packaging - COB
COB: - Fine Au, Al wire with diameter from 2 mils down to 0.8 mils. - Ball bonds, wedge-wedge and ribbon bonds. - Minimum bond pitch at 3.5 mils. - Die bond accuracy down to 10 micron. - Capable of handling six different dice. - Wafer mapping as well as dice are available.
Tong Hsing Production Service and Introduction
Tong Hsing Electronic Industries, Ltd. is Taiwan supplier and manufacturer in Global Microelectronic Packaging and Ceramic Substrate Fabrication Market since 1975. Tong Hsing has been offering our customers high quality CMOS Image Sensor Packaging, MEMS Packaging, SiP Packaging, Thick Film,Thin Film Substrates, Automotive Hybrids, PA and Front-end Modules for Handsets & WLAN. With both advanced technology and 37 years experience, Tong Hsing always make sure to meet each customer's demand.
Contact Us
Tong Hsing Electronic Industries, Ltd.
Lane 365, Yingtao Rd, Yinko Dist., New Taipei City 23942, Taiwan (GPS Coordinate: N24°57.733'/E121°19.862')
TEL: 886-2-26790122 ext.1901 or 1903
FAX: 886-2-26791211 ext.1901 or 1903