Welcome to Tong Hsing Electronic Industries, Ltd.
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.
Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
Assembly Packaging - GGI Flip Chip、C4 Flip Chip、COB、SMT
Tong Hsing Electronic offer superior assembly and testing service for high power module product.
Substrate Manufacturing Services - Thin Film Substrate(DBC)、Thin Film Substrate(DPC)
News and Events
- Tong Hsing Via the ISO13485:2003 Medical Device quality management standard
"ISO13485 Quality management system for the design of medical systems"More
- Tong Hsing has been awarded the Outstanding Photonics Product Award 2012
Tong Hsing Electronic Industries, LTD.More