PA and Front-end Modules for Handsets & WLANTong Hsing Electronic Industries, Ltd.
MEMS Packaging, SiP PackagingThick Film and Thin Film Substrates

Specialize in PA front-end modules, MEMS packaging, thick film and thin film ceramic substrates, SiP, automotive hybrids.

Automotive Hybrids

Address: 55, Lane 365, Yingtao Road, Yinko, Taipei Hsien, Taiwan
Tel: +886-2-2679-0122      Fax: +886-2-2670-0122
E-mail: service@mail.theil.com.tw