Welcome to Tong Hsing Electronic Industries, Ltd.
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.
Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
SMT, COB Assembly(including C4 & GGI Flip Chip), Lid Attach, Overmold, Dicing and Many Other Advanced Packaging Services
Tong Hsing Electronic offer superior DBC substrate and assembly service for high power module product.
Direct Plated Copper(DPC), Direct Bonded Copper(DBC) and Thick Film Metalized Substrate